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- Schneider Electric SSP1A150BDT Harmony SSP1 50A Panel Mount 3-32V DC In 24-300V AC Out Solid State Relay Schneider Electric SSP1A150BDT Harmony SSP1 50A Panel Mount 3-32V DC In 24-300V AC Out Solid State Relay
Schneider Electric SSP1A150BDT Harmony SSP1 50A Panel Mount 3-32V DC In 24-300V AC Out Solid State Relay
Schneider Electric SSP1A150BDT Harmony SSP1 50A Panel Mount 3-32V DC In 24-300V AC Out Solid State Relay
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- Description
The Schneider Electric SSP1A150BDT is a Harmony SSP1 panel-mount solid state relay rated 50 A with zero-voltage switching, a 3-32 V DC control input, and a 24-300 V AC load output. It ships with a thermal pad for heatsink mounting, switches loads up to 2 hp at 240 V AC, and carries an IP20 rating.
Technical Specifications
| Reference | SSP1A150BDT |
| Brand | Schneider Electric |
| Range | Harmony Solid State Relays |
| Series | SSP1 |
| Product Type | Panel mount relay (solid state) |
| Number of Phases | 1 |
| Mounting Support | Panel |
| Line Rated Current | 50 A |
| Solid State Output Type | SCR output, zero voltage switching |
| Control Circuit Voltage (Uc) | 3...32 V DC |
| Output Voltage | 24...300 V AC |
| Load Current | 0.15...50 A |
| Surge Current | 625 A (16.6 ms) |
| Maximum Voltage Drop | < 1.15 V (on-state) |
| Motor Controller Rating | 0.75 hp (120V AC) / 2 hp (240V AC) |
| Insulation Resistance | 1000 MOhm at 500 V DC |
| Dielectric Strength | 4 kV AC (input/output) |
| Rated Impulse Withstand Voltage (Uimp) | 6 kV |
| Co-ordination Type | Type 1: 40 A MCB(B) / Type 2: 32 A MCB(B) |
| Thermal Resistance | 0.45 C/W junction to case |
| Provided Accessory | Thermal pad |
| IP Degree of Protection | IP20 |
| Ambient Air Temperature (Operation) | -40...80 C |
| Net Weight | 0.089 kg |
Certifications & Standards
- CE
- UL
- EAC
- CSA
- IEC 62314
- CSA C22.2 No 14-13
- IEC 60950-1
- UL 508
Selection Notes
SSP1A150BDT doubles the load current of the 25 A SSP1 sibling in the same panel-mount package, handling motor loads up to 2 hp at 240 V AC. Its lower thermal resistance (0.45 C/W versus 0.8 C/W on the 25 A part) reflects the larger die needed to dissipate heat at 50 A - the same thermal pad interface (0.48 C-in2/W) still applies, but the heatsink must handle roughly double the dissipated power. Surge current (625 A/16.6 ms) and MCB coordination (Type 1: 40 A, Type 2: 32 A) are sized up accordingly for upstream short-circuit protection selection.